High Quality Optical / Optoelectronic Packages | EPI
EPI offers both traditional TO header glass-to-metal seals as well as ceramic-based optical TO-header packages to enable more complex circuit patterns in optoelectronic devices.
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Ceramic Optical Module Housing
Complete Ceramic Housing Solutions for Optical Communication and
Optical switches, modules, and high-power laser systems Innovacera offers a one-stop ceramic packaging solution, ranging from standard components to fully customized designs.
Machined Housings for Optical Modulator Housing
AMETEK ECP''s modulator housing design offers versatility and reliability for today''s high-performance optical equipment. The housing is designed to enable optical devices used for 100G and 400G
Complete Ceramic Housing Solutions for Optical
Optical switches, modules, and high-power laser systems Innovacera offers a one-stop ceramic packaging solution, ranging from standard components
Optical Module Housings Guide
Discover the role of optical module housings in data centers & 5G. Learn about materials like ceramics & alloys, thermal challenges, and explore Link-PP''s optical transceivers.
Ceramic Packages, Submounts, and Lids for Optical
Kyocera provides a wide range of components for optoelectronics and optical communications modules, including packages, submounts, and lids.
Hermetic Ceramic Packages for ROSA/TOSA Modules
These specialized housings are built to optimize optoelectronic integration, delivering superior hermetic sealing, outstanding thermal stability, and high mechanical strength—essential for rigorous data
Leadless Hermetic And Non-Hermetic SMT Packages | Remtec
Our economical surface-mounted ceramic packages can be produced for a wide range of circuits and I/O configurations, all fully compatible with most JEDEC TO-style window caps, including TO-5, TO
Hermetic,Packages
Dual in line packages such as the pressed ceramic Cerpack, and the multilayer ceramic flatpack are available in the lower leadcounts. These packages typically have a lead pitch of 50 mils.
ITLA butterfly package-Optispac,Inc.
The package feed-through component adopts HTCC high-temperature ceramic design structure, which effectively increases the lead density and air density reliability, and meets the miniaturization needs
Ceramic Packages / Ceramic Substrates | KYOCERA
Kyocera provides ceramic substrates and packages, fiber optic communication module components, optical fiber connection components, and more.